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Edge Program Application
We are excited that you have decided to apply for the EDGE Program. EDGE is designed to help emerging leaders accelerate their leadership growth by collaborating with like-minded professionals while learning and applying today's leading leadership principles.
- This application must be completed in its entirety.
- The 2026–2027 EDGE Program will run from October 26, 2026, through March 9, 2027, and includes a combination of virtual webinar sessions and an in-person experience at Leadership Summit, February 18–20, 2027, in Orlando, Florida.
- Please ensure you can commit to all program components before applying, as successful completion of the program requires full participation.
- Participation is limited, and applicants will be selected through a committee review process.
- Applicants will be notified of their application status by September 29, 2026.
- Recipients will receive a scholarship that covers $1,100 of the EDGE Program registration fee and three nights of lodging during Leadership Summit in Orlando, Florida.
Please note: Participants are responsible for the remaining $200 Edge Program registration balance. This scholarship covers lodging only for Leadership Summit in Orlando, Florida (February 18–20, 2026). All other travel and expenses are the responsibility of the participant or their organization.
We are grateful to our government partner, Sourcewell, for funding this scholarship and supporting NIGP's mission to develop, support, and promote excellence in public procurement.
Individuals are eligible to apply for this NIGP scholarship if they meet the following eligibility requirements:
- Maintain current NIGP membership in good standing (Agency or Individual Member)
- Have not received any of the following NIGP scholarships:
- 2026 Leadership Summit EDGE/Impact Scholarship
- 2025–2026 Professional Development Scholarship
- 2026 Forum Scholarship (In-Person or Virtual)
The deadline to submit applications is September 11, 2026 at 11:59pm EST.
Click here to begin your application.